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공공누리This item is licensed Korea Open Government License

Title
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test
Author(s)
강지훈
Publication Year
2011-06-15
Abstract
A novel pull-off test that mimics the actual thermal NIL process was conducted to investigate the adhesion properties between a flat fused silica and thermoplastic polymer film used in thermal NIL process. The pull-off force was measured under various NIL conditions?such as use of various polymer materials, imprint pressures, and separation velocities?and the surfaces of the mold and polymer film were observed after the test. The anti-sticking layer (ASL) derived from (1H,1H,2H,2H-perfluorooctyl)richlorosilane (F13-OTS) was coated on the fused silica and its effects on the adhesion characteristics was also examined. In cases of the mold without ASL, the pull-off force varied significantly according to the process conditions and damage on the polymer film was observed in most of the tests. In cases of the mold coated with the ASL, on the other hands, the pull-off force was maintained at a lower level in the range of the imprint pressure from 2 to 10 MPa or separation velocity from 1 to 25 lm/s, and there was no damage to the polymer film due to adhesion.
Keyword
Thermal nanoimprint lithography; Adhesion; Anti-sticking layer; Fused silica; Thermoplastic polymer film; Pull-off test
Journal Title
Microelectronic engineering
Citation Volume
88
ISSN
0167-9317
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Appears in Collections:
7. KISTI 연구성과 > 학술지 발표논문
URI
https://repository.kisti.re.kr/handle/10580/13962
http://www.ndsl.kr/ndsl/search/detail/article/articleSearchResultDetail.do?cn=NART55617323
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