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공공누리This item is licensed Korea Open Government License

dc.contributor.author
강지훈
dc.date.accessioned
2019-08-28T07:41:02Z
dc.date.available
2019-08-28T07:41:02Z
dc.date.issued
2011-06-15
dc.identifier.issn
0167-9317
dc.identifier.uri
https://repository.kisti.re.kr/handle/10580/13962
dc.identifier.uri
http://www.ndsl.kr/ndsl/search/detail/article/articleSearchResultDetail.do?cn=NART55617323
dc.description.abstract
A novel pull-off test that mimics the actual thermal NIL process was conducted to investigate the adhesion properties between a flat fused silica and thermoplastic polymer film used in thermal NIL process. The pull-off force was measured under various NIL conditions?such as use of various polymer materials, imprint pressures, and separation velocities?and the surfaces of the mold and polymer film were observed after the test. The anti-sticking layer (ASL) derived from (1H,1H,2H,2H-perfluorooctyl)richlorosilane (F13-OTS) was coated on the fused silica and its effects on the adhesion characteristics was also examined. In cases of the mold without ASL, the pull-off force varied significantly according to the process conditions and damage on the polymer film was observed in most of the tests. In cases of the mold coated with the ASL, on the other hands, the pull-off force was maintained at a lower level in the range of the imprint pressure from 2 to 10 MPa or separation velocity from 1 to 25 lm/s, and there was no damage to the polymer film due to adhesion.
dc.language
eng
dc.relation.ispartofseries
Microelectronic engineering
dc.title
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test
dc.citation.number
6
dc.citation.startPage
855
dc.citation.volume
88
dc.subject.keyword
Thermal nanoimprint lithography
dc.subject.keyword
Adhesion
dc.subject.keyword
Anti-sticking layer
dc.subject.keyword
Fused silica
dc.subject.keyword
Thermoplastic polymer film
dc.subject.keyword
Pull-off test
Appears in Collections:
7. KISTI 연구성과 > 학술지 발표논문
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