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공공누리This item is licensed Korea Open Government License

Title
Creep behavior of a poled PZT wafer under longitudinal tensile stress and through thickness electric field
Author(s)
김상주이창환
Publication Year
2009-04-07
Abstract
A commercially available soft PZT wafer that is poled in thickness direction is subjected to
three different sets of loading environment, and variations of electric displacement in
thickness direction and longitudinal transverse strains are measured over time. Pure tensile
stress creep experiments are made in short and open circuit conditions. Different
material responses in the two electrical boundary conditions are explained by the effects
of piezoelectrically produced internal electric field on linear material moduli and domain
switching mechanisms.
Keyword
PZT wafer; Domain switching; creep; tensile stress; electric field
Journal Title
International journal of solids and structures
Citation Volume
46
ISSN
0020-7683
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Appears in Collections:
7. KISTI 연구성과 > 학술지 발표논문
URI
https://repository.kisti.re.kr/handle/10580/13810
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