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공공누리This item is licensed Korea Open Government License

Title
Compact, lightweight, and highly efficient circular heat sink design for high-end PCs
Author(s)
최지훈정민중
Publication Year
2015-10-01
Abstract
With the demand for powerful computing performance features, the high-end desktop and industrial PC markets are expected to grow significantly despite the exploding use of mobile internet devices. At present active air cooling devices comprised of various finned heat sink, heat pipe, and fan combinations is popular. In addition to cooling, this combination meets the strict design constraints required for cost, noise, volume, and weight. To better meet these demands, in this paper, a new heat sink design is introduced based on the benefits of the circular heat sink of existing CPU cooling devices. The heat sink was proposed to be lightweight and have as a small volume as possible, while providing the same performance of existing CPU cooling devices. A simulation-driven design technique was used to investigate performance as well as the airflow and thermal behavior of the proposed heat sink. Corresponding physical performance testing was also conducted to validate the simulation results. The proposed heat sink was capable of dissipating a heat load of 130W at temperatures of less than 85 °C under the low noise level of 23 dBA, which is similar to the cooling performance of the existing devices.
Keyword
CPU; Heat sink; Active cooling; Simulation driven-design
Journal Title
Applied Thermal Engineering
Citation Volume
92
ISSN
1359-4311
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Appears in Collections:
7. KISTI 연구성과 > 학술지 발표논문
URI
https://repository.kisti.re.kr/handle/10580/14436
http://www.ndsl.kr/ndsl/search/detail/article/articleSearchResultDetail.do?cn=NART73797372
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