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This item is licensed Korea Open Government License
- dc.contributor.author
- 김기섭
- dc.contributor.author
- 최종덕
- dc.contributor.author
- 손효주
- dc.contributor.author
- 김경수
- dc.contributor.author
- 정설희
- dc.date.accessioned
- 2022-06-27T05:58:21Z
- dc.date.available
- 2022-06-27T05:58:21Z
- dc.date.issued
- 2018
- dc.identifier.uri
- https://repository.kisti.re.kr/handle/10580/17662
- dc.publisher
- 한국과학기술정보연구원
- dc.title
- HPC용 Main board PCB 개발
- dc.type
- Report
- dc.contributor.affiliation
- 한국과학기술정보연구원
- dc.contributor.affiliation
- KISTI
- dc.contributor.affiliation
- 이수페타시스
- dc.identifier.localId
- 8072334
- dc.subject.keyword
- 신호 무결성
- dc.subject.keyword
- 반사손실
- dc.subject.keyword
- 신호 특성 최소화
- dc.subject.keyword
- 최적 요소 기술
- dc.subject.keyword
- Non spread glass
- dc.subject.keyword
- Glass weave effect
- dc.subject.keyword
- Panel rotation
- dc.subject.keyword
- Copper foil
- dc.subject.keyword
- Roughness
- Appears in Collections:
- 7. KISTI 연구성과 > 연구보고서 > 2018
- Files in This Item:
- There are no files associated with this item.
